It looks like Qualcomm is in the final stage of the new gen chipset like we just published the leaked graphs of the tests that were performed on :
Seeing the results of all the ranges of chips, it looks like Qualcomm is working to improve the chips but in the Mid-Low Segment they haven't been successful in keeping the temperatures under control and we may see the new devices with the Snapdragon 420 to be getting heated more than the Snapdragon 410 chips. That being said, Qualcomm is probably working on optimizing the chips and trying to get all the issues fixed.
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Today we got the graphs of the Snapdragon 420 chipset compared with Snapdragon 410. The Snapdragon 410 has not been reported have any performance or heating issues. We have seen the chipset being used in popular phones like Samsung Grand Prime, Xiaomi Redmi 2, and even in the recently launched Moto E 2nd Gen. But the Snapdragon 420 which is the next iteration of the Snapdragon 410 seems to be heating more than its predecessor.
As the chipsets are currently in development, the final variant may have the issues resolved but as of now the chipsets are having some heating issues and Qualcomm may even delay the launch of the Snapdragon 420 to try and rectify the problem.
From the graphs we can see that Snapdragon 410 is cooler at 41 degrees than the Snapdragon 420 which touched 44 Degree Celcius. Both the test devices had no Cellular or Wifi antennae nor Bluetooth, and featured a qHD display with 4.7 inches of screen size. The test game played on the devices was Asphalt 8 on Medium Graphics setting.
Seeing the results of all the ranges of chips, it looks like Qualcomm is working to improve the chips but in the Mid-Low Segment they haven't been successful in keeping the temperatures under control and we may see the new devices with the Snapdragon 420 to be getting heated more than the Snapdragon 410 chips. That being said, Qualcomm is probably working on optimizing the chips and trying to get all the issues fixed.
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